Ahmed Sharif

Ahmed Sharif

Professor

Professor

Qualification: PhD
Phone: 5516 7100 Ext: 7681
asharif@mme.buet.ac.bd

Biography

PERSONAL INFORMATION Full Name:  DR. AHMED SHARIF
Current Position: Professor
Date of Birth:  March 7, 1972
Mailing Address: Dept. of MME, BUET, Dhaka
Phone No: 8801912802486
Facsimile: 88029665618
E-mail:  asharif@mme.buet.ac.bd
EDUCATION Degree Year Graduating

Institution

 Major
Ph.D. 2006 City University of Hong Kong, Hong Kong Materials Science and Engineering
M.Sc. Engg. 2001 BUET Metallurgical Engg.
B.Sc. Engg. 1998 BUET Metallurgical Engg.
EMPLOYMENT RECORD Designation with Institution Period
From To
Professor, BUET 04-03-2014 To date
Assoc. Prof, BUET 27-01-2010 03-03-2014
Asstt. Prof, BUET 25-08-2002 26-01-2010
Lecturer, BUET 4-11-1999 24-08-2002

 

AWARDS
  • Research Fellowship, School of Materials Science and  Engineering, Nanyang Technological University, Singapore, June 2011- August 2012.
  • Visiting Assistant Professor, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, October 2008 and October 2009.
  • Visiting Research Fellow, Department of Electronic Engineering, City University of Hong Kong, Hong Kong, November 2007
  • Received the “IEEE CPMT Young Award” for the paper entitled “Effect of Aging on the Interfacial Reaction of BGA Sn-Ag-Cu and Sn-Ag Solders with Ni(P)/Au Surface Finish on Cu Pad” presented at the International Conference on Electronic Packaging 2004, Tokyo, Japan (ICEP 2004).
  • Received the “Outstanding Student Prize” from the Department of Electronic Engineering, City University of Hong Kong in recognition of his outstanding performance and active participation in external academic activities in 2004-2005.
PROFESSIONAL CONTRIBUTIONS Reviewer of international Journals

  1. Journal of Alloys and Compounds (Elsevier)
  2. Microelectronics Reliability (Elsevier)
  3. Surface and Coatings Technology (Elsevier)
  4. Materials Chemistry and Physics (Elsevier)
  5. Journal of Materials Research (MRS, USA)
  6. Solder and Surface Mount Technology (Emerald, UK)
  7. The Journal of Adhesion (Taylor & Francis, UK)

Editorial Member 

  1. Advances in Alloys and Compounds, Columbia International Publishing.

Publications

PUBLICATIONS (Last 5 years):

(a)     Journal Publications:

Journal Publications [Science citation index (SCI) listed]:

  1. S.Mallick, M. S.Kabir,A. Sharif. Study on the properties of Zn–xNi high temperature solder alloys. Journal of Materials Science: Materials in Electronics, 1-11, 2016, DOI:10.1007/s10854-015-4198-2.
  2. A. Sharif, Review on advances in nanoscale microscopy in cement research. Micron, Volume 80, pp. 45-58, 2016.
  3. M. K. Islam,A. Sharif, Nanocharacterization of interface between natural fiber and polymer matrix: an overview. Composite Interfaces, Volume 614, pp.1-19, 2015.
  4. T.Fakhrul, R.Mahbub,N.Chowdhury, Q. D.M.Khosru,A. Sharif, Structural, dielectric and magnetic properties of Ta-substituted Bi0.8La0.2FeO3 multiferroics, Journal of Alloys and Compounds, Volume 614, pp. 471-476, 2015.
  5. A. Sharif, C. L. Gan,Z.Chen, Customized glass sealant for ceramic substrates for high temperature electronic application, Microelectronics Reliability, Volume 54 (12), pp. 2905-2910, 2014.
  6. M. O. Haque, A. Sharif, Utilization of open pit burned household waste ash- a feasibility study in Dhaka, Waste Management & Research, Volume 32 (5), pp. 397-405, 2014.
  7. A. Sharif, C.L.Gan, Z. Chen, Transient Liquid Phase Ag-based Solder Technology for High-temperature Packaging Applications, Journal of Alloys and Compounds, Volume 587C, pp. 365-368, 2014.
  8. M. M.Billah, K.M.Shorowordi,A. Sharif, Effect of Micron Size Ni Particle Addition in Sn-8Zn-3Bi Lead-free Solder Alloy on the Microstructure, Thermal and Mechanical Properties, Journal of Alloys and Compounds, Volume 585,pp. 32–395, 2014.
  9. A. Sharif, J. Z. Lim, R. I. Made, F. L. Lau, E. J. R. Phua, J. D. Lim, C. C. Wong, C. L. Gan,  Z. Chen,Pb-Free Glass Paste: A Metallization- Free Die-Attachment Solution for High- Temperature Application on Ceramic Substrates, Journal of Electronic Materials, Volume 42 (8), pp. 2667-2676, 2013.
  10. T. Fouzder, I. Shafiq,, Y. C. Chan, A. Sharif,Winco K. C. Yung, “Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn-AgCu solder on Au/Ni metallized Cu pads” Journal of Alloys and Compounds, Volume 509 (5) pp. 1885-189, 2011.
  11. T. Fouzder,  A. K. Gain, Y. C. Chan,A. Sharif, Winco K. C. Yung,Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads, Microelectronics Reliability, Volume 50 (12) pp. 2051–2058, 2010.
  12. A. K. Gain, T. Fouzder,  Y. C. Chan,A. Sharif, Winco K. C. Yung,The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads,Journal of Alloys and Compounds, Volume 506 (1) pp. 216-223, 2010.
  13. M. Ahmed, T. Fouzder,  A. Sharif, A. K. Gain, Y. C. Chan, Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy, Microelectronics Reliability, Volume 50 (8), pp. 1134-1141, 2010.
  14. A. K. Gain, Tama Fouzder, Y. C. Chan, A. Sharif and Winco K. C. Yung, Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads, Journal of Alloys and compounds, Volume 489 (2), pp. 678-684, 2010.
  15. A. K. Gain, Y. C. Chan, A. Sharif and Winco K. C. Yung, Effect of small Sn-3.5Ag-0.5Cu additions on the structure and properties of Sn-9Zn solder in ball grid array packages, Microelectronic Engineering, Volume 86 (11), pp. 2347-2353, 2009.
  16. A. K. Gain, Y. C. Chan, A. Sharif, N. B. Wong and Winco K. C. Yung, Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn Solder in Ball Grid Array Packages, Microelectronic Relaibility, Volume 49 (7), pp. 746-753, 2009.
  17. S. K. Das, A. Sharif, Y. C. Chan, N. B. Wong and W. K. C. Yung, Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy, Journal of Alloys and compounds, Volume 481 (1-2), pp. 167-172, 2009.
  18. S. K. Das, A. Sharif, Y. C. Chan, N. B. Wong and W. K. C. Yung, Effect of Ag micro particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads, Microelectronic Engineering, Volume 86 (10), pp. 2086-2093, 2009
  19. I. Shafiq and A. Sharif, Synthesis and characterization of indium doped cadmium sulfide nanoribbons, Journal of Physics D-Applied Physics Volume 42 (3) 035412, 2009.
  20. I. Shafiq, A. Sharif, and L. C. Sing, ZnSxSe1-x nanowire arrays with tunable optical properties grown on ZnSnanoribbon substrates, Physica E: Low-dimensional Systems and Nanostructures Volume 41 pp. 739-745, 2009.
  21. A. Sharif and Y. C. Chan, Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints, Microelectronic Engineering, Volume 84 (2) pp. 328-335, Feb. 2007.
  22. A. Sharif and Y. C. Chan, Retardation of spalling through the addition of Ag in Sn-Zn-Bi solder with the Au/Ni metallization, Materials Science and Engineering A, Volume 445-446, pp. 686-690, Feb. 2007.
  23. A. Sharif and Y. C. Chan, Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni(P) metallization, Journal of Alloy and compounds, Volume 440 (1-2), pp.117–121, 2007.
  24. A. Sharif, Y. C. Chan and H. W. Zhong, Effect of Multiple Reflows on Mechanical Strength of the Interface Formed between Sn-Zn-Bi Solder and Au/Ni/Cu Bond Pad, Journal of Materials Research, Volume 22 (1) pp. 40-45, Jan. 2007.
  25. A. Sharif and Y. C. Chan, Effect of reaction time on mechanical strength of the interface formed between Sn-Zn (-Bi) solder and Au/Ni/Cu bond pad, Journal of Electronic Materials, Volume 35 (10), pp.1812-1817, 2006.
  26. A. Sharif and Y. C. Chan, Liquid and solid state interfacial reactions of Sn–Ag–Cu and Sn–In–Ag–Cu solders with Ni–P under bump metallization, Thin Solid Films, Volume 504 (1-2), pp. 431-435, 2006.
  27. A. Sharif and Y. C. Chan, Interfacial Reactions on Electrolytic Ni and Electroless Ni(P) metallization with Sn-In-Ag-Cu solder, Journal of Alloys and Compounds, Volume 393 (1-2), pp.135-140, 2005.
  28. M. J. Rizvi, Y. C. Chan, C. Bailey, H. Lu and A. Sharif, Effect of Curing on Performance of ACF Bonded Chip-on-Flex Assembly after Thermal Ageing,     Soldering & Surface Mount Technology, Volume 17(3), pp.40-48, 2005.
  29. M. N. Islam, Y. C. Chan, A. Sharif, and M. J. Rizvi, Effect of 9 wt% In addition in Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu Pads, Journal of Alloys and Compounds, Volume 396 (1-2), pp.217-223, 2005.
  30. M. N. Islam, Y. C. Chan, M. O. Alam and A. Sharif, Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag solder alloy, ASME Journal of Electronic Packaging, Volume 27(4), pp.365-369, 2005.
  31. M N Islam, A. Sharif and Y. C. Chan, Effect of Volume in Interfacial Reaction Between Eutectic Sn-3.5%Ag-0.5%Cu Solder and Cu Metallization in Microelectronic Packaging, Journal of Electronic Materials, Volume 34 (2), pp.143-149, 2005.
  32. A. Sharif and Y. C. Chan, Interfacial Reactions of Sn-3.5%Ag and Sn-3.5%Ag-0.5%Cu Solder with Electroless Ni/Au Metallization During Multiple Reflow Cycles, Journal of Materials Science: Materials in Electronics, Volume 16 (3), pp.153-158, 2005.
  33. A. Sharif and Y. C. Chan, Effect of Indium Addition in Sn-rich Solder on the Dissolution of Cu Metallization, Journal of Alloys and Compounds, Volume 390 (1-2), pp.67-73, 2005.
  34. A. Sharif and Y. C. Chan, Comparative Study of Interfacial Reactions of Sn-Ag-Cu and Sn-Ag Solders on Cu Pads During Reflow Soldering, Journal of Electronic Materials, Volume 34 (1), pp.46-52, 2005.
  35. A. Sharif, Y. C. Chan, M N Islam and M Z. Rizvi, Dissolution of Electroless Ni Metallization by Lead-Free Solder Alloys, Journal of Alloys and Compounds, Volume 388 (1), pp.75-82, 2005.
  36. A. Sharif, M. N. Islam and Y. C. Chan, Interfacial reactions of BGA Sn-3.5%Ag-0.5%Cu and Sn-3.5%Ag solders during high temperature aging with Ni/Au metallization, Materials Science and Engineering (B): Solid State Materials for Advanced Technology, Volume 113 (3), pp. 184-89, 2004.
  37. M. N. Islam, Y. C. Chan, A. Sharif, Interfacial reactions of Sn-Cu and Sn-Pb-Ag solder with Au/Ni during extended time reflow in ball grid array packages, Journal of Materials Research, Volume 19 (10), pp. 2897-2904, 2004.
  38. A. Sharif, Y. C. Chan and R. A. Islam, Effect of Volume in Interfacial Reaction Between Eutectic Sn-Pb solder and Cu Metallization in Microelectronic Packaging, Materials Science and Engineering (B): Solid State Materials for Advanced Technology, Volume 106 (2), pp. 120-25, 2004.
  39. A. Sharif and Y. C. Chan, Dissolution Kinetics of BGA Sn-Pb and Sn-Ag Solders with Cu Substrates During Reflow, Materials Science and Engineering (B): Solid State Materials for Advanced Technology, Volume 106 (2), pp. 126-131, 2004.
  40. M. N. Islam, Y. C. Chan, A. Sharif and M O Alam, Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless Ni–P by the Molten Sn3.5Ag0.5Cu Solder Alloy, Journal of Microelectronics Reliability,Volume 43 (12), pp. 2031-37, 2003.
  41. M. M. Haque and A. Sharif,Study on Wear Behaviour of Aluminium-Silicon Piston Alloy, Journal of Materials Processing Technology, Volume 118, pp. 69-73, 2001.

 

(a2) Journal Publications [others]:

(xxxxii)    AKMS Uddin, MK Islam, HM Ferdousi, A. Sharif,A Comprehensive Review of Recent Trend in Nano-Dental Materials Research, International Journal of Innovation and Scientific Research 13 (2), 659–665, 2015.

(xxxxiii)    S Mallick, MS Kabir, A. Sharif, Effect of Ni additions on the microstructure of Zn based lead free solder alloys for high temperature applications, International Journal of Innovation and Scientific Research 15 (2) 452–456, 2015.

(xxxxiv) MS Haque,A. Sharif, Processing and Characterization of Waste Denim Fiber Reinforced Polymer Composites, International Journal of Innovative Science and Modern Engineering 2 (6), 18-22, 2014.

(xxxxv) MMHasan, A. Sharif, M. A. Gafur, Microstructure and Bulk Material Properties of Zn-Al Alloys as an Exciting Replacement of Lead Based High Temperature Interconnect Materials, International Journal of Science and Advanced Technology, 4 (1), pp. 20-27, 2014

(xxxxvi)    T Fakhrul, A. Sharif, Effect of Sintering Temperature on Microstructure and Densification of La and Ta Doped BiFeO3, International Journal of Science and Modern Engineering (IJISME) 2 (3), pp. 13-19, 2014.

(xxxxvii)    SMKN Islam, A. Sharif, T Alam, Interfacial Microstructure, Microhardness and Tensile Properties of Al Micro-Particle Doped Sn-9Zn Eutectic Pb-Free Solder Alloy for Microelectronics Applications, Journal of Telecommunication, Electronic and Computer Engineering (JTEC), Volume 4 (2), pp. 2180-1843. 2012.

 

(b)     Proceeding Publications:

(i)    E. P. J. Rong, I. Riko, A. Sharif, W. C. Cheong, C. Zhong, D. R. MinWoo, G. C. Lip,Electronic packages for high pressure applications: A dome-shaped cavity design, Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 2342-2348.

(ii)    L. J. Dy, E. P. J. Rong, I. Riko, A. Sharif, L. J. Zhang, L. F. Long, G. C. Lip, C. Zhong, D. R. MinWoo, W. C. Cheong,Study of thin film metallization adhesion in ceramic multichip module, IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, 67-71.

(iii)    L. J. Zhang, A. Sharif, H. B. Yeung E. P. J. Rong, I. Riko, L. F. Long, L. J. Dy, W. C. Cheong,Ceramic—Ceramic joining using glass frit for high temperature application, IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, 38-42

(iv)    Md. M. Billah, T. Alam, M. A. Hossain, A. Sharif and S. M. K. N. Islam,Effect of Al addition on the thermal and mechanical behavior of Sn-9Zn eutectic pb-free solder alloy, International Conference on Mechanical Engineering 2011 (ICME2011), BUET, Dhaka, Bangladesh, Dec 18-20, 2011, ICME 11-AM-016.

(v)    M. A. Hossain, S. M. K. N. Islam, M. Billah, T. Alam and A. Sharif,Effect of carbon nanotubes on the microhardness of lead free solders for nano-electronics application, International Conference on Mechanical Engineering 2011 (ICME2011), BUET, Dhaka, Bangladesh, Dec 18-20, 2011, ICME 11-RT-034.

(vi)    T. Rahman, A Sharif, K M Shorowordi,Development of grinding media balls using locally available materials, The Third International Conference on Structure, Processing and Properties of Materials (SPPM2010), 24-26 February 2010, Dhaka, Bangladesh, A11.

(vii)    M. Ahmed, A. Sharif, Improving the performance of Sn-Zn lead-free solder with Ag micro-particle reinforcements, The Third International Conference on Structure, Processing and Properties of Materials (SPPM2010), 24-26 February 2010, Dhaka, Bangladesh, B 01.

(viii)    M. O. Haque, M. A. A. Sharif, A. Sharif, Characterization of Incinerated Bottom Ash of Municipal Solid Waste of Dhaka, The Third International Conference on Structure, Processing and Properties of Materials (SPPM 2010), 24-26 February 2010, Dhaka, Bangladesh, H 06.

(ix)    M. Rahman, A. Sharif and M. Ahmed, “Effect of Various Amount of Cu on the Thermal and Mechanical Behavior of Sn-9Zn Eutectic Pb-free Solder Alloy” International Conference on Mechanical Engineering 2009(ICME2009), BUET, Dhaka, Bangladesh, Dec 26-28, 2009.

(x)    S. K. Das and A. Sharif, “Influence of Small Amount of Al and Cu Addition on the Structure and Properties of Sn-9Zn Solder Alloy for Electronic Packaging”, International Conference on Advances in Materials and Processing Technology (AMPT 2009),Kuala Lumpur, Malaysia,October26-29, 2009 (also published in Journal of Alloys and compounds, 2009).

(xi)    S. K. Das and A. Sharif, “A study of Ag micro-particle reinforced Sn-Zn matrix composite solder” 33rd International Conference on Electronic Manufacturing and Technology (IEMT 2008), Penang, Malaysia,November 4-6, 2008 (also published in Microelectronic Engineering, 2009).

(xii)    A. K. Gain, Y. C. Chan, K. C. Yung, A Sharif and L. Ali, “Effect of Nano Ni Additions on the Structure and Properties of Sn-9Zn and Sn-8Sn-3Bi Solder in Ball Grid Array Packages” 2nd Electronics Systemintegration Technology Conference (ESTC 2008), Greenwich, UK, September 1-4, 2008.

(xiii)    A Sharif and Y. C. Chan “Effect of 3 wt.% Bi in Sn-Zn solder on the interfacial reaction with the Au/Ni metallization” 31st International Conference on Electronic Manufacturing and Technology (IEMT 2006), Kuala Lumpur, Malaysia, November 8-10, 2006.

(xiv)    A. Sharif and Y. C. Chan “Liquid and solid state interfacial reaction of Sn-Ag-Cu and Sn-In-Ag-Cu solders with Ni-P under bump metallization” International Conference on Materials for Advanced Technologies 2005 (ICMAT 2005) 9th International Conference on Advanced Materials (IUMRS-ICAM) Singapore, July 3-8, 2005 (also published in Thin Solid Films, 2006).

(xv)    A. Sharifand Y. C. Chan “Effect of Aging on the Interfacial Reactions of BGA Sn-Ag-Cu and Sn-Ag Solders with Ni(P)/Au Surface Finish on Cu Pad” Proceedings of the International Conference on Electronic Packaging, 2004 ICEP, Tokyo, Japan, April 14-16, 2004.

(xvi)    R. Islam, A. Sharifand R. Haque “Change in Reduction Behaviour of Iron Oxide Coal Composite Pellets due to the Addition of Sodium Carbonate” Procedings of the 3rd International Conference of Mechanical Engineers and 8th Annual Paper Meet on E-Manufacturing, IEB, Bangladesh, March 20-22, 2003.

(xvii)    A. Sharif, K.M Shorowordi and A.K.M. Bazlur Rashid  “Wear Behavior  of Cutting Tools During the Machining of Al-Metal Matrix Composite” on International Conference on Manufacturing (ICM 2002), BUET, Dhaka, Bangladesh, Aug. 6-7, 2002.

(xviii)    A. Sharif, K.M. Shorowordi and A.K.M. Bazlur Rashid “Ageing Response  of SiCp Addition in Al – 7Si -0.3 Mg Alloy” on International  Conference on Mechanical Engineering, ICME2001, BUET, Dhaka, Bangladesh, Dec 26-28, 2001.

(xix)    Md. MohafizulHaque and A. Sharif‘‘Study on Wear Behaviour of Aluminium-Silicon Piston Alloy” on International Conference on Advance Material And Processing Technology for 1999, Dublin City University, Dublin, Ireland, August 3-6, 1999 (also published in Journal of Materials Processing Technology, 2001).

 

(c)    Books:

Book Chapters

  1. Sharif(2015). Trends in Nanoscopy in Materials Research: Nano-scale Microscopic Characterization of Cements. (Book Chapter)in Advanced Research on Nanotechnology for Civil Engineering Applications.Edited by Anwar Khitab.IGI Global, Pennsylvania (USA), article in press.

 

M.K.Islam, and A. Sharif, Zn-Based Solders for High Temperature Electronic Application. In: SaleemHashmi (editorin-chief), Reference Module in Materials Science and Materials Engineering. Oxford: Elsevier; 2016. pp. 1-10.

 

Patent

  1. M. Riko, E. P. J. Rong, A. Sharif, W. C. Cheong, C. Zhong, V. C. Nachiappan, H. B. Yeung, D. R. MinWoo, G. C. Lip, “Shaped Optimized Packaging for High Temperature and Pressure”, Singapore Patent Application No. 20124339-4 (filed on 12 Jun 2012).