Tender Notices 6. RFQ Package Package No: G11 Package Description: Supply, Installation/Testing and Commissioning of Air Conditioner for Laboratory of the Department of Materials and Metallurgical Engineering under HEQEP Sub-Project CP No. 3117 Re-Tender: Last Date of Submission: December 02, 2015 at 11:00 am Last Date of Submission: September 16, 2015 11.00 am Contact: Directorate of P&D of BUET for REQUEST FOR QUOTATION DOCUMENT. 5. OTM e-GP Notices A total of 05 packages Click here (PDF, 88 KB) for the notice and details. 4. RFQ Package: Package No: G7 Package Description: Supply of books and journals for SPM Office, and Textbooks, Handbook and Journals for the Department of Materials and Metallurgical Engineering under HEQEP Sub-Project CP No. 3117 Re-Tender: Last Date of Submission: January 26, 2015 11.00 am Last Date of Submission: January 20, 2015 11.00 am Contact: Directorate of P&D of BUET for REQUEST FOR QUOTATION DOCUMENT. 3. RFQ Package: Package No: G1 Package Description: Supply of Computer, IT and Office Equipment for the Department of Materials and Metallurgical Engineering under HEQEP Sub-Project CP No. 3117 Last Date of Submission: January 12, 2015 11.00 am Contact: Directorate of P&D of BUET for REQUEST FOR QUOTATION DOCUMENT. 2. RFQ Package: Package No: G10 [Supply, Installation/Testing and Commissioning of Furniture and Fixtures for SPM Office and Laboratory] Package Description: Supply and Installation of Furniture and Fixture for the Department of Materials and Metallurgical Engineering under HEQEP Sub-Project CP No. 3117 Last Date of Submission: December 10, 2014 11 am Contact: Directorate of P&D of BUET for REQUEST FOR QUOTATION DOCUMENT. 1. RFQ Package: Package No: G9 [Supply of Grinding and Polishing Consumables] Package Description: Supply of Grinding and Polishing Consumables for the Department of Materials and Metallurgical Engineering under HEQEP Sub-Project CP No. 3117 Last Date of Submission: December 10, 2014 11 am Contact: Directorate of P&D of BUET for REQUEST FOR QUOTATION DOCUMENT.